Title :
Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics
Author :
Johnso, Scott T.
Author_Institution :
Raytheon Sensors & Electron. Syst. Co., El Segundo, CA, USA
Abstract :
Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. Basic design guidelines for the practicing engineer are provided
Keywords :
computational fluid dynamics; cooling; design engineering; flow simulation; laminar flow; military equipment; military systems; modules; thermal analysis; thermal management (packaging); 1D discrete branch point model; CFD simulations; air flow-through modular electronics; cooling systems; design guidelines; field electronics thermal management; flow rate; fluid dynamics; forced air cooling; forced liquid cooling; laminar regime; liquid flow test data; liquid flow-through modular electronics; manifold analysis; manifold design; manifold fluid flow networks; manifold systems; military electronics packaging; modular electronics; pressure distribution; transitional regime; Design engineering; Electronics cooling; Engineering management; Fluid dynamics; Fluid flow; Liquid cooling; Manifolds; Thermal engineering; Thermal management; Thermal management of electronics;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915184