DocumentCode
3021476
Title
A solar module fabrication process for HALE solar electric UAVs
Author
Carey, P.G. ; Aceves, R.C. ; Colella, N.J. ; Williams, K.A. ; Sinton, R.A. ; Glenn, G.S.
Author_Institution
Lawrence Livermore Nat. Lab., CA, USA
Volume
2
fYear
1994
fDate
5-9 Dec 1994
Firstpage
1963
Abstract
We describe a fabrication process used to manufacture high power-to-weight-ratio flexible solar array modules for use on high-altitude-long-endurance (HALE) solar-electric unmanned air vehicles (UAVs). These modules have achieved power-to-weight ratios of 315 and 396 W/kg for 150 μm-thick monofacial and 110 μm-thick bifacial silicon solar cells, respectively. These calculations reflect average module efficiencies of 15.3% (150 μm) and 14.7% (110 μm) obtained from electrical tests performed by Spectrolab, Inc. Under AM0 global conditions at 25°C, and include weight contributions from all module components (solar cells, lamination material, bypass diodes, interconnect wires, and adhesive tape used to attach the modules to the wing). The fabrication, testing, and performance of 32 m2 of these modules are described
Keywords
aircraft; electric vehicles; elemental semiconductors; laminations; semiconductor device testing; semiconductor materials; silicon; solar cell arrays; solar cells; 110 mum; 14.7 percent; 15.3 percent; 150 mum; AM0 global conditions; HALE solar electric UAV; RAPTOR PATHFINDER airplane; Si; Spectrolab; adhesive tape; average module efficiencies; bifacial Si solar cells; bypass diodes; electrical tests; flying wing; interconnect wires; lamination material; monofacial Si solar cells; power-to-weight ratios; solar module fabrication process; unmanned air vehicles; Diodes; Fabrication; Flexible manufacturing systems; Lamination; Manufacturing processes; Performance evaluation; Photovoltaic cells; Silicon; Testing; Unmanned aerial vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
Conference_Location
Waikoloa, HI
Print_ISBN
0-7803-1460-3
Type
conf
DOI
10.1109/WCPEC.1994.520753
Filename
520753
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