• DocumentCode
    3021731
  • Title

    SAW-relevant material properties of langasite in the temperature range from 25 to 750 °C: New experimental results

  • Author

    Shrena, Ismail ; Eisele, David ; Mayer, Elena ; Reindl, Leonhard M. ; Bardong, Jochen ; Schmitt, Martin

  • Author_Institution
    Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    The aim of this work is to determine the acoustical parameters of langasite up to the highest possible point of temperature. This paper presents measurements of transfer functions for delay lines on langasite at frequencies ranging from 150 MHz to 1 GHz, at temperatures from 25 to 750degC. Two cuts with Euler angles (0deg, 138.5deg, 26.6deg) and (0deg, 30.2deg, 26.6deg) have been studied. The devices were fabricated using langasite as substrate, with two different platinum (Pt) layer heights (45 nm and 75 nm), on a zirconium (Zr) adhesion layer (4 nm). A special signal processing algorithm utilizing cross-correlation was implemented in MATLAB and used for the analysis of measured data. The material parameters relevant for SAW devices, such as phase velocity, propagation loss, and electromechanical coupling coefficient, have been determined as a function of temperature.
  • Keywords
    acoustic signal processing; high-temperature effects; lanthanum compounds; platinum; surface acoustic wave delay lines; surface acoustic waves; transfer functions; zirconium; La3Ga5SiO14; MATLAB; Pt; SAW devices; Zr; delay lines; frequency 150 MHz to 1 GHz; langasite; surface acoustic waves; temperature 25 degC to 750 degC; transfer function; Acoustic measurements; Adhesives; Delay lines; Frequency measurement; Material properties; Platinum; Signal processing algorithms; Temperature distribution; Transfer functions; Zirconium; SAW; acoustical parameters; component; high temperature; langasite; material properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0051
  • Filename
    4803421