• DocumentCode
    3022061
  • Title

    Block-level fault isolation using partition theory and logic minimization techniques

  • Author

    Shi, C. J Richard

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
  • fYear
    1997
  • fDate
    28-31 Jan 1997
  • Firstpage
    319
  • Lastpage
    324
  • Abstract
    Multichip modules are emerging as a key packaging technology for mixed-signal circuits and systems. In this paper, we consider how to localize a failure within a chip boundary as rapidly as possible in order to expedite the rework process and to minimize its overall impact on manufacturing throughput and cycle time. A key contribution of this paper is to provide a unified block-level fault isolation framework for analog and digital circuits, and to show that optimum fault isolation reduces to set covering. This allows us to apply directly powerful set covering techniques and solvers developed recently in logic minimization. In addition, we present a greedy peeling heuristic with performance bound computation. Some preliminary experimental results are included to demonstrate the feasibility and performance of the proposed approach
  • Keywords
    fault location; logic design; minimisation of switching nets; multichip modules; packaging; block-level fault isolation; chip boundary; cycle time; fault isolation framework; greedy peeling heuristic; logic minimization techniques; manufacturing throughput; mixed-signal circuits; multichip modules; optimum fault isolation; packaging technology; partition theory; rework process; set covering; Circuit faults; Circuits and systems; Digital circuits; Isolation technology; Logic; Manufacturing processes; Multichip modules; Packaging; Pulp manufacturing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
  • Conference_Location
    Chiba
  • Print_ISBN
    0-7803-3662-3
  • Type

    conf

  • DOI
    10.1109/ASPDAC.1997.600169
  • Filename
    600169