DocumentCode
3022061
Title
Block-level fault isolation using partition theory and logic minimization techniques
Author
Shi, C. J Richard
Author_Institution
Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
fYear
1997
fDate
28-31 Jan 1997
Firstpage
319
Lastpage
324
Abstract
Multichip modules are emerging as a key packaging technology for mixed-signal circuits and systems. In this paper, we consider how to localize a failure within a chip boundary as rapidly as possible in order to expedite the rework process and to minimize its overall impact on manufacturing throughput and cycle time. A key contribution of this paper is to provide a unified block-level fault isolation framework for analog and digital circuits, and to show that optimum fault isolation reduces to set covering. This allows us to apply directly powerful set covering techniques and solvers developed recently in logic minimization. In addition, we present a greedy peeling heuristic with performance bound computation. Some preliminary experimental results are included to demonstrate the feasibility and performance of the proposed approach
Keywords
fault location; logic design; minimisation of switching nets; multichip modules; packaging; block-level fault isolation; chip boundary; cycle time; fault isolation framework; greedy peeling heuristic; logic minimization techniques; manufacturing throughput; mixed-signal circuits; multichip modules; optimum fault isolation; packaging technology; partition theory; rework process; set covering; Circuit faults; Circuits and systems; Digital circuits; Isolation technology; Logic; Manufacturing processes; Multichip modules; Packaging; Pulp manufacturing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location
Chiba
Print_ISBN
0-7803-3662-3
Type
conf
DOI
10.1109/ASPDAC.1997.600169
Filename
600169
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