DocumentCode
3022811
Title
A High-Linearity Energy-Efficient CMOS PA for Wireless Environment Monitoring
Author
Wei Zou ; Bo Zhao ; Pengpeng Chen ; Huazhong Yang
Author_Institution
Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
fYear
2013
fDate
29-30 June 2013
Firstpage
32
Lastpage
35
Abstract
For power amplifier in wireless sensor network (WSN) nodes used for environment monitoring, there are three important factors, i.e. maximum output power, power efficiency and linearity. In this paper, two techniques are proposed to achieve good linearity, i.e. a negative feedback path with 180 degree phase shift, and a capacitance compensation technology to keep the overall input capacitance of driver stage constant. Furthermore, bond wire inductors with a high quality factor are proposed as chock inductors, which enhance both efficiency and linearity by raising drain voltage of common-gate transistors and cutting down the power loss in chock inductors. Simulation results demonstrate the PA achieves a maximum output power of 23.5 dBm with 42 % power added efficiency (PAE) and a 23 dBm output 1-dB compression point with 35% PAE. The two-tone test shows 5-10 dBc improvement in the third-order intermodulation distortion (IMD3) compared to a PA with on-chip chock inductors.
Keywords
CMOS analogue integrated circuits; Q-factor; capacitance; feedback; inductors; intermodulation distortion; power amplifiers; wireless sensor networks; IMD3; PAE; WSN nodes; bond wire inductors; capacitance compensation technology; chock inductors; efficiency 35 percent; efficiency 42 percent; environment monitoring; linearity; maximum output power; negative feedback path; power added efficiency; power amplifier; power efficiency; third-order intermodulation distortion; two-tone test; wireless sensor network; Automation; Manufacturing; Deep N-well technology; Power Amplifier (PA); bond wire inductors; capacitance compensation; negative feedback path;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Manufacturing and Automation (ICDMA), 2013 Fourth International Conference on
Conference_Location
Qingdao
Type
conf
DOI
10.1109/ICDMA.2013.9
Filename
6597927
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