DocumentCode
3023028
Title
Recent advancement in microgap electrode fabrication by conventional photolithography technique
Author
Humayun, Q. ; Hashim, U.
Author_Institution
Nano Struct. Lab.-On-Chip Res. Group, Univ. Malaysia Perlis (UniMap), Kangar, Malaysia
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
22
Lastpage
25
Abstract
The biosensors which based on polysilicon material should be sensitive and selective for the detection of label free bio molecule. The objective of this research is to characterize, design, and fabricate polysilicon nanogap. The proposed device was designed initially in two masks by using AutoCAD software and then transferred to commercial chrome mask. The standard CMOS photolithography process coupled with ICP dry etching process is used for fabrication of the proposed nanogap. The fabrication process start by microgap formation and than by size expansion technique the microgap expand to nanogap and finally gold pad were deposited on polysilicon nanogap surface. Using TEM, FIB, FESEM and AFM the nanogap was inspected and characterized. At last the surface modification of polysilicon nanogap and DNA immobilization is done on polysilicon nanogap for the testing and validation by using real biological samples. The initial study demonstrates the fabrication of microgap of 1, 2, 3μm and 40.7, 43.5, 115.2, 335.9μm on polysilicon wafer samples.
Keywords
biosensors; electrodes; microfabrication; nanofabrication; photolithography; AFM; AutoCAD software; DNA immobilization; FESEM; FIB; ICP dry etching process; TEM; biological samples; biosensors; chrome mask; label free bio molecule detection; microgap electrode fabrication; microgap expand; microgap formation; nanogap fabrication; photolithography technique; polysilicon material; polysilicon nanogap surface; size expansion technique; standard CMOS photolithography process; surface modification; two masks; DNA; Electrodes; Fabrication; Gold; Nanobioscience; Resists; Silicon; DNA immobilization; Photolithography; Polysilicon; chrome mask; microgap; size expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417082
Filename
6417082
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