• DocumentCode
    3023072
  • Title

    Temperature compensation of thin AlN film resonators utilizing the lowest order symmetric lamb mode

  • Author

    Wingqvist ; Arapan, L. ; Yantchev, V. ; Katardjiev, I.

  • Author_Institution
    Dept. Solid State Electron., Uppsala Univ., Uppsala
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    1207
  • Lastpage
    1210
  • Abstract
    Micromachined thin film plate acoustic wave resonators (FPAR) utilizing the lowest order symmetric Lamb wave (S0) propagating in highly textured 2 mum thick Aluminum Nitride (AlN) membranes have been successfully demonstrated. However, a notable drawback of the proposed devices is their non-zero temperature coefficient of frequency (TCF) which lies in the range -20 ppm/K to -25 ppm/K. In this work temperature compensation of thin AlN film Lamb wave resonators is studied and demonstrated. Temperature compensation, while retaining at the same time the device electromechanical coupling, is experimentally demonstrated. The zero TCF Lamb wave resonators are fabricated onto composite AlN/SiO2 membranes. Q factors of around 1400 have been measured at a frequency of around 755 MHz.
  • Keywords
    III-V semiconductors; aluminium compounds; compensation; micromachining; piezoelectric thin films; surface acoustic wave resonators; AlN; Lamb wave resonators; Q factors; device electromechanical coupling; lowest order symmetric Lamb mode; micromachining; nonzero temperature coefficient of frequency; temperature compensation; thin film plate acoustic wave resonators; Acoustic reflection; Acoustic waves; Biomembranes; Frequency; Gratings; Surface acoustic waves; System-on-a-chip; Temperature distribution; Topology; Transistors; AlN; Compensation; Lamb wave; Microacoustics; Resonator; TCF;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0291
  • Filename
    4803473