DocumentCode
3023072
Title
Temperature compensation of thin AlN film resonators utilizing the lowest order symmetric lamb mode
Author
Wingqvist ; Arapan, L. ; Yantchev, V. ; Katardjiev, I.
Author_Institution
Dept. Solid State Electron., Uppsala Univ., Uppsala
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
1207
Lastpage
1210
Abstract
Micromachined thin film plate acoustic wave resonators (FPAR) utilizing the lowest order symmetric Lamb wave (S0) propagating in highly textured 2 mum thick Aluminum Nitride (AlN) membranes have been successfully demonstrated. However, a notable drawback of the proposed devices is their non-zero temperature coefficient of frequency (TCF) which lies in the range -20 ppm/K to -25 ppm/K. In this work temperature compensation of thin AlN film Lamb wave resonators is studied and demonstrated. Temperature compensation, while retaining at the same time the device electromechanical coupling, is experimentally demonstrated. The zero TCF Lamb wave resonators are fabricated onto composite AlN/SiO2 membranes. Q factors of around 1400 have been measured at a frequency of around 755 MHz.
Keywords
III-V semiconductors; aluminium compounds; compensation; micromachining; piezoelectric thin films; surface acoustic wave resonators; AlN; Lamb wave resonators; Q factors; device electromechanical coupling; lowest order symmetric Lamb mode; micromachining; nonzero temperature coefficient of frequency; temperature compensation; thin film plate acoustic wave resonators; Acoustic reflection; Acoustic waves; Biomembranes; Frequency; Gratings; Surface acoustic waves; System-on-a-chip; Temperature distribution; Topology; Transistors; AlN; Compensation; Lamb wave; Microacoustics; Resonator; TCF;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0291
Filename
4803473
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