Title :
Close-proximity, real-time thermoacoustic sensors: Design, characterization, and testing
Author :
Choi, Michael ; Ang, Woon ; Chen, Jie
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Alberta, Edmonton, AB, Canada
Abstract :
This paper describes the design, characterization, and testing of a close-proximity, real-time thermoacoustic sensor for ultrasound intensity measurements. Plexiglass sensors, 20 mm diameter and 3.3 mm length, absorbed ultrasound with a frequency of 1.5 MHz, a 20% duty cycle, and a 1 kHz pulse repetition frequency, at intensities between 30 and 100 mW/cm2. An embedded system design fit thermistor temperature data to a curve relating the temperature rise averaged across the backside of the sensor to the applied ultrasound intensity, and calculated the corresponding ultrasound intensity. Good linearity was demonstrated between the ultrasound intensity measured using a radiation force balance, and intensity measured using the thermoacoustic sensor when placed in contact with the acoustic transducer: accuracy within 5% of the target value and standard deviation of 4.55% or less. The sensor has an operational temperature range of 22°C to 26°C. This design makes for a quick and convenient method of checking ultrasound intensity, and also presents the possibility of integrated sensor and ultrasound generator systems using feedback loops to achieve auto-calibration.
Keywords :
acoustic intensity measurement; acoustic transducers; calibration; intelligent sensors; temperature measurement; temperature sensors; thermistors; acoustic transducer; autocalibration; embedded system design; feedback loop; frequency 1 kHz; frequency 1.5 MHz; plexiglass sensor; pulse repetition frequency; radiation force balance; size 20 mm; size 33 nm; temperature 22 degC to 26 degC; thermistor temperature data; thermoacoustic sensor; ultrasound generator system; ultrasound intensity measurement; Acoustics; Temperature measurement; Temperature sensors; Ultrasonic imaging; Ultrasonic variables measurement;
Conference_Titel :
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-0218-0
DOI :
10.1109/ISCAS.2012.6271977