• DocumentCode
    3023458
  • Title

    Flexible Film-Based Sensors Structured with a High Piezoresistive Organic Molecular Conductor as an Active Component

  • Author

    Laukhina, Elena ; Pfattner, Raphael ; Mas-Torrent, Marta ; Rovira, Concepció ; Veciana, Jaume ; Laukhin, Vladimir

  • Author_Institution
    CIBER de Bioingenieria, Biomater. y Nanomedicina (CIBER-BBN), Spain
  • fYear
    2010
  • fDate
    18-25 July 2010
  • Firstpage
    4
  • Lastpage
    9
  • Abstract
    This article is addressed to developing flexible all-organic bi layer (BL) film-based sensors being capable of measuring strain as a well-defined electrical signal in a wide range of elongations and temperature. The purpose was achieved by covering polycarbonate films with the polycrystalline layer of a high piezoresistive organic molecular conductor. This type of sensors is able to take the place of conventional metal-based strain and pressure gages in low cost innovative controlling and monitoring technologies. To determine restrictions for sensor applications, we studied the effect of monoaxial strain on the resistance and texture of the sensing layers of BL films. The tests shown that the maximum strain before fracture is about 1%; under relative strain >1% the strain cracking of a sensing conducting organic layer was observed. A simple thermal recuperation of the damaged sensing layer of the BL film-based sensors is also presented.
  • Keywords
    electric properties; mechanical properties; strain measurement; thin film sensors; active component; flexible film-based sensors; high piezoresistive organic molecular conductor; polycarbonate films; strain measurement; thermal recuperation; Conductors; Films; Resistance; Robot sensing systems; Strain; Temperature sensors; flexible film-based sensors; molecular conductors; monoaxial elongations; thermal recuperation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensor Device Technologies and Applications (SENSORDEVICES), 2010 First International Conference on
  • Conference_Location
    Venice
  • Print_ISBN
    978-1-4244-7474-5
  • Type

    conf

  • DOI
    10.1109/SENSORDEVICES.2010.9
  • Filename
    5632100