Title :
Piezoelectric MEMS for audio signal transduction, microfluidic management, resonant mass sensing, and movable surface micromachined structures
Author_Institution :
Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA
Abstract :
This paper describes piezoelectric MEMS that offer competitive advantages over existing commercial technologies in audio, ultrasonic, air borne, microfluidic and RF applications. Specifically, a piezoelectric microphone requires a much simpler fabrication process than a condenser microphone, while a piezoelectric microspeaker is both planar and amenable to MEMS process for mass production unlike an electrodynamic speaker. Micromachined self-focusing acoustic transducers can eject picoliter liquid droplet in any oblique angle, without any clog-prone nozzle. Resonant mass sensors based on film bulk-acoustic resonators (FBAR) offer inherently higher sensitivity and smaller active area than a quartz microbalance. Piezoelectrically actuated cantilever can be moved in both directions (i.e., into and away-from a stationary electrode) unlike an electrostatically actuated cantilever, and provides a wide tuning ratio for a tunable capacitor.
Keywords :
audio signal processing; microfluidics; microphones; piezoelectric transducers; audio signal transduction; clog-prone nozzle; film bulk-acoustic resonators; mass production; microfluidic management; micromachined self-focusing acoustic transducers; movable surface micromachined structure; picoliter liquid droplet; piezoelectric MEMS; piezoelectric microphone; piezoelectric microspeaker; piezoelectrically actuated cantilever; resonant mass sensing; resonant mass sensor; tunable capacitor; Electrodynamics; Fabrication; Film bulk acoustic resonators; Loudspeakers; Mass production; Microfluidics; Micromechanical devices; Microphones; Radio frequency; Resonance; FBAR; actuated mirror array; microphone; microspeaker; piezoelectric; resonant mass sensor; selffocusing acoustic transducer; tunable capacitor;
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
DOI :
10.1109/ULTSYM.2008.0223