Title :
The effect of surface morphology to photoluminescence spectrum porous silicon
Author :
Suhaimi, M. H. Fadzilah ; Zubaidah, M.A. ; Yusop, S.F.M. ; Rusop, M. ; Abdullah, Saad
Author_Institution :
NANO-SciTech Centre (NST), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
Abstract :
The porous silicon nanostructures was prepared by electrochemical etching of p-type silicon wafer. Porous silicon structure has good mechanical robustness, chemical stability, and compatibility with existing silicon technology. Therefore, it also has a wide area of potential applications such as waveguides, 1D photonic crystals, chemical sensors, biological sensor etc. Photoluminescences characteristics of porous silicon depend on their morphology because the size and distribution of pore its self will effect to their exciton energy level. The structure of porous silicon controlled by the parameters used during the experiment which know as experimental factor. These factors such as etching time, current density applied, temperature, doping concentration etc play an important role during the formation of porous. It will effect either to the thickness or porosity of sample. In this work, we select one of that factor to corellate which optical properties of porous silicon. We investigated the surface morphology by using Atomic Force Microscope (AFM) and photoluminescences using Photoluminescences (PL) spectrometer.
Keywords :
photoluminescence; porous materials; silicon; 1D photonic crystals; AFM; atomic force microscope; biological sensor; chemical sensors; chemical stability; compatibility; doping concentration; electrochemical etching; etching time; exciton energy level; mechanical robustness; photoluminescence spectrum porous silicon; photoluminescences characteristics; photoluminescences spectrometer; porous silicon nanostructures; silicon technology; surface morphology; waveguides; Etching; Morphology; Rough surfaces; Silicon; Surface morphology; Surface topography;
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
DOI :
10.1109/SMElec.2012.6417112