• DocumentCode
    3023781
  • Title

    Figures of merit for system path time estimation

  • Author

    Hsi, C.G. ; Tucker, S.G.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1990
  • fDate
    17-19 Sep 1990
  • Firstpage
    49
  • Lastpage
    55
  • Abstract
    A model to help in the evaluation of various technologies for large systems is presented. The space modeled is considered to be made up of a number of VLSI chips sufficient to comprise a CPU and cache arranged on a single planar package. The inputs consist of technology constraints and system design parameters. From these, a number of design characteristics are computed based on formulas derived from relationships observed in previous generations of large systems, and a system path-time figure of merit is then calculated. With some additional simplifying assumptions, several technology figures of merit can be derived. These include a measure of circuit density in circuits/ns2, a generalized power-delay-cooling figure of merit, and a technology figure of merit involving the ratio of circuit delay to circuits/ns2. The relationship of these to several existing chip and package technology figures of merit is also discussed
  • Keywords
    VLSI; circuit reliability; packaging; CPU; VLSI chips; cache; circuit delay; circuit density; figure of merit; planar package; power-delay-cooling; system path time estimation; Central Processing Unit; Cooling; Delay; Logic arrays; Logic circuits; Logic design; Magneto electrical resistivity imaging technique; Packaging; Power system modeling; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1990. ICCD '90. Proceedings, 1990 IEEE International Conference on
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-8186-2079-X
  • Type

    conf

  • DOI
    10.1109/ICCD.1990.130159
  • Filename
    130159