DocumentCode
3024802
Title
Geometrical characterization of single layer silicon based piezoresistive microcantilever using ANSYS
Author
Zakaria, M.H. ; Bais, Badariah ; Rahim, R.A. ; Majlis, Burhanuddin Yeop
Author_Institution
Dept. of Electr. Electron. & Syst. Eng., Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
336
Lastpage
339
Abstract
In this paper, characterization on the geometrical aspects of a single layer, p-doped silicon based piezoresistive microcantilever using finite element method is presented. The displacement and the von Mises stress obtained from the simulation were observed by varying the geometries of the microcantilever namely the thickness, length, width and the distance between the piezoresistor legs. The sensitivity of the microcantilever was then calculated and tabulated. From the simulation results, it can be shown that the displacement and sensitivity of the single layer piezoresistive microcantilever is comparable to the dual layer counterpart with the thinner microcantilever resulted in a maximum displacement and sensitivity, compared to other geometrical factors.
Keywords
cantilevers; electronic engineering computing; elemental semiconductors; finite element analysis; micromechanical devices; piezoresistive devices; resistors; silicon; ANSYS; Si; finite element method; geometrical characterization; piezoresistor legs; single layer p-doped silicon based piezoresistive microcantilever; single layer piezoresistive microcantilever displacement; von Mises stress; Finite element methods; Legged locomotion; Load modeling; Piezoresistance; Sensitivity; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417154
Filename
6417154
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