DocumentCode :
3024829
Title :
Improvement of liquid-phase SH-SAW sensor device on 36° Y-X LiTaO3 substrate
Author :
Kogai, Takashi ; Yatsuda, Hiromi ; Shiokawa, Showko
Author_Institution :
Japan Radio Co., Ltd., Fujimino-shi
fYear :
2008
fDate :
2-5 Nov. 2008
Firstpage :
98
Lastpage :
101
Abstract :
In this paper we describe liquid-phase two-channel Shear Horizontal Surface Acoustic Wave (SH-SAW) sensors to detect conductivity and permittivity of the liquids. In the case of the low-permittivity liquids, the SH-SAWs in the delay-line having an unmetallized propagation area can be degraded owing to the lack of SH-SAW energy concentration of the surface. Then the obtained permittivity and conductivity of the liquids were slightly different from the exact values. In this paper, the delay-line having the electrically-opened thin film metallic-gratings (OP-GR) on the propagation area has been proposed instead of the delay-line having unmetallized propagation area. The OP-GR delay-line gives a good SH-SAW energy concentration of the surface even though low permittivity liquids. The experimental results of the liquid-phase SH-SAW sensors with a center frequency of 30 MHz have been shown.
Keywords :
electrical conductivity; lithium compounds; permittivity measurement; surface acoustic wave delay lines; surface acoustic wave sensors; tantalum compounds; LiTaO3; OP-GR delay-line; SH-SAW energy concentration; Y-X lithium tantalate substrate; electrically-opened thin film metallic-gratings; frequency 30 MHz; liquid conductivity detection; liquid permittivity detection; liquid-phase SH-SAW sensor device; shear horizontal surface acoustic wave sensor; two-channel SH-SAW delay-line sensor; unmetallized propagation area; Acoustic propagation; Acoustic sensors; Acoustic signal detection; Acoustic waves; Conductivity; Liquids; Permittivity; Propagation delay; Sensor phenomena and characterization; Surface acoustic wave devices; SH-SAW; component; diptype; liquid-phase; sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
Type :
conf
DOI :
10.1109/ULTSYM.2008.0024
Filename :
4803542
Link To Document :
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