• DocumentCode
    3025163
  • Title

    Lead zirconate titanate thick film with enhanced electrical properties for high frequency transducer applications

  • Author

    Zhu, B.P. ; Wu, D.W. ; Zhou, Q.F. ; Shung, K.K.

  • Author_Institution
    Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    70
  • Lastpage
    73
  • Abstract
    Piezoelectric Pb(Zr0.52Ti0.48)O3 thick film with the thickness around 10 mum has been deposited on the (111) Pt/Ti/SiO2/Si substrate using a ceramic powder/sol-gel solution modified composite method. X-ray diffraction analysis and scanning electron microscope revealed that the film was in the well-crystallized perovskite phase and cracked free. At 1 KHz, The dielectric constant and the loss were 1925 and 0.015, respectively. The remnant polarization was 42.0 muC/cm2 at room temperature. A high frequency single element acoustic transducer fabricated with this film showed a bandwidth at -6 dB of 50% at 156 MHz.
  • Keywords
    X-ray diffraction; biomedical transducers; biomedical ultrasonics; dielectric losses; dielectric polarisation; lead compounds; permittivity; piezoelectric thin films; piezoelectric transducers; scanning electron microscopy; sol-gel processing; thin film devices; ultrasonic transducers; PZT; Pt-Ti-SiO2-Si; Si; X-ray diffraction analysis; ceramic powder method; clinical imaging; crystallized perovskite phase; dielectric constant; dielectric loss; dielectric polarization; electrical property; frequency 1 kHz; frequency 156 MHz; high frequency transducer applications; lead zirconate titanate thick film; piezoelectric thick film; scanning electron microscope; single element ultrasonic transducer; sol-gel solution modified composite method; temperature 293 K to 298 K; Ceramics; Dielectric substrates; Electrons; Frequency; Lead; Piezoelectric transducers; Powders; Thick films; Titanium compounds; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0018
  • Filename
    4803557