Thermal and optical analysis of four-chip HPLED package with different thermal interface material

This paper is focused on thermal and optical properties of four-chip HPLED package with different thermal interface materials. The package is attached to MCPCB via solder paste and thermal compound. Through cumulative structure function, solder point of HPLED package is determined as 2.955K/W. The photometric properties of these two HBLED packages are evaluated by using TERALED. The total thermal resistance of the HPLED-S and HPLED-C is 10.68K/W and 13.00K/W respectively. Results show that the junction temperatures of HPLED with solder paste is lower than HPLED with thermal compound. Optical power, wall plug efficiency and luminous flux of both packages under various ambient temperature and forward current are discussed in this study. The HPLED-C produces more luminance than HPLED-S, but high thermal resistance of the HPLED-C induces the rise in junction temperature therefore increases the degradation rate of wall plug efficiency of the package.