Title :
Study on SAW devices having face to face aligned packaged structure
Author :
Koh, Keishin ; Yamazaki, Takanori ; Terao, Yuji ; Hohkawa, Kohji
Author_Institution :
Fac. of Eng., Kanagawa Inst. of Technol., Kanagawa
Abstract :
In this paper, we will report novel method to realize small packaged size SAW device and functional SAW devices, in which two SAW devices are bonded by face to face bonding (FFB). We propose several kinds of FFB SAW devices and package structure of FFB SAW devices. We propose fabrication process such as via holes formation, bonding and dicing, we fabricated test devices using Quartz substrate and estimate basic characteristics of device and experiment results verify the possibility of this packaging method. We investigated effect of various parameters such as adhesive material thickness, dimension of package.
Keywords :
surface acoustic wave devices; wafer bonding; wafer level packaging; Quartz substrate; adhesive material thickness; dicing; fabrication process; face-to-face aligned packaged structure; face-to-face bonding; functional SAW devices; hole formation; package dimension; packaging method; Aging; Costs; Electronics packaging; Fabrication; Packaging machines; Surface acoustic wave devices; Surface acoustic waves; Temperature; Wafer bonding; Wafer scale integration; Face to Face bonding; Packaging; SAW devices; Wafer level chip size packaging;
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
DOI :
10.1109/ULTSYM.2008.0389
