Investigation of crosstalk impact on channel performance from IC package and motherboard breakout routing

Author

Hasani, A.H. ; Shahar, A.M. ; Yusof, A.J. ; Kong, Jackson

Author_Institution

Sch. of EE, Univ. Sains Malaysia, Nibong Tebal, Malaysia

fYear

2012

fDate

19-21 Sept. 2012

Firstpage

583

Lastpage

587

Abstract

Crosstalk is one of the signal integrity (SI) issues which is critical especially in systems with high operating speed and high circuit density. In this paper, the impact of crosstalk on channel performance is investigated based on the IC package and motherboard breakout routing. Differential pair spacing and coupling length were manipulated for the IC package breakout routing and motherboard breakout routing respectively. First, the crosstalk behavior on the breakout routing models are investigated in frequency and time domain. Next, the breakout routing models are used in the channel analysis, along with other components that form a channel. The crosstalk impact towards the channel is presented in terms of eye diagram parameters. Some conclusions are presented and can be used as a guideline for future circuit designers.

Keywords

crosstalk; frequency-domain analysis; integrated circuit packaging; network routing; time-domain analysis; IC package breakout routing; SI issues; channel performance; coupling length; crosstalk behavior; differential pair spacing; eye diagram parameters; frequency domain; motherboard breakout routing; signal integrity; time domain; Analytical models; Couplings; Crosstalk; Frequency domain analysis; Integrated circuit modeling; Routing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on

Conference_Location

Kuala Lumpur

Print_ISBN

978-1-4673-2395-6

Electronic_ISBN

978-1-4673-2394-9

Type

conf

DOI

10.1109/SMElec.2012.6417213

Filename

6417213