• DocumentCode
    3026350
  • Title

    Design of single-stage folded-cascode gain boost amplifier for 14bit 12.5Ms/S pipelined analog-to digital converter

  • Author

    Xuelian Liu ; McDonald, John

  • Author_Institution
    Dept. of Electr., Comput., & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    622
  • Lastpage
    626
  • Abstract
    This paper describes the design and simulation of a fully-differential, high gain, high speed CMOS Operational Transconductance Amplifier (OTA). The op-amp is designed for unity gain sampler stage of 14bit 12.5Ms/s pipeline analog-to digital converter. The design is implemented using a folding cascode topology with the addition of gain boosting amplifiers for increased gain. Common-mode feedback (CMFB) is used to stable the designed OTA against temperature and other process variations. This design has been implemented in 0.13μm IBM RF mixed signal CMOS Technology. The Spectre simulation shows the DC gain of 91.5 dB and a unity-gain frequency of 714.5MHz with phase margin of 62° (double 7.5-pF load) while consuming 9 mW power. For the normal corner, the settling time to 1/2 LSB of 14bit A/D converter accuracy is 40 ns.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; feedback amplifiers; mixed analogue-digital integrated circuits; operational amplifiers; radiofrequency integrated circuits; A-D converter; CMFB; IBM RF mixed signal CMOS technology; Spectre simulation; capacitance 7.5 pF; common-mode feedback; folding cascode topology; frequency 714.5 MHz; gain 91.5 dB; high speed operational transconductance amplifier; op-amp; pipeline analog-to digital converter; power 9 mW; single-stage folded-cascode gain boost amplifier design; size 0.13 mum; time 40 ns; word length 14 bit; Accuracy; Boosting; CMOS integrated circuits; Equations; Gain; Logic gates; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417222
  • Filename
    6417222