• DocumentCode
    3026352
  • Title

    High-frequency (50–100MHz) medical ultrasound transducer arrays produced by micromachining bulk PZT materials

  • Author

    Liu, C.G. ; Wu, D.W. ; Zhou, Q.F. ; Djuth, F.T. ; Shung, K.K.

  • Author_Institution
    Geospace Res. Inc., El Segundo, CA
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    690
  • Lastpage
    693
  • Abstract
    This paper describes the development and characterization of a high frequency (65 MHz) ultrasound transducer array. The array was built using bulk PZT that was etched using an optimized chlorine-based plasma process. The median etch rate of 6 mum/hr yielded a good profile (sidewall) angle (>830) and a reasonable processing time for etch depths up to 40 mum. A backing layer having an acoustic impedance of 6 MRayl together with a front-end matching layer of parylene yielded a transducer bandwidth of 40%. The impedance of the backing material will be increased to 20 MRayls in the near future, and this will increase the bandwidth to 70%. The two-way insertion loss and cross talk between adjacent channels at the center frequency are 26.5 dB and -25 dB, respectively.
  • Keywords
    acoustic impedance; biomedical transducers; biomedical ultrasonics; lead compounds; micromachining; piezoelectric materials; piezoelectric transducers; sputter etching; ultrasonic transducer arrays; PZT; acoustic impedance; adjacent channel crosstalk; backing layer; bulk piezoelectric material; chlorine-based plasma etching process; frequency 50 MHz to 100 MHz; front-end matching layer; high-frequency medical transducer; loss 26.5 dB; micromachining; parylene; two-way insertion loss; ultrasound transducer arrays; Bandwidth; Biomedical transducers; Etching; Frequency; Impedance; Micromachining; Plasma applications; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; bulk PZT; high frequency; micromachining; transducer array; ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0166
  • Filename
    4803601