Title :
Stress analysis on centric through hole PCB
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Rahman, N.A.Z. ; Man, B. ; Nadzri, N.S. ; Vairavan, Rajendaran
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Alam Pauh Putra, Malaysia
Abstract :
In this study, the bending process of PCB during depaneling is simulated. The stress response during the bending process is evaluated using a computational program Ansys. Two PCB plate model were developed: One of the model with centric through hole and other model without hole. The stress response of the two models are compared. From the simulation, it has been observed that the value of stress response of the PCB increases with increasing displacement height. The without hole PCB model exhibited a slightly higher stress response compared to the with centric through hole PCB model. Highest stress response for both models were recorded at the displacement height of 5cm.
Keywords :
bending; printed circuits; stress analysis; bending process; centric through hole PCB; computational program Ansys; depaneling; displacement height; printed circuit board plate model; stress response; Computational modeling; Integrated circuit modeling; Load modeling; Microelectronics; Printed circuits; Solid modeling; Stress; Printed circuit board(PCB); centric through holes; depaneling process;
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
DOI :
10.1109/SMElec.2012.6417226