DocumentCode :
3027049
Title :
A novel integrated design simulation method for linear cellular and WLAN power amplifiers
Author :
Kuran, S. ; Huang, Chun-Wen Paul ; Xu, Sheldon
Author_Institution :
Anadigics Inc., Warren, NJ, USA
Volume :
3
fYear :
2003
fDate :
14-17 Dec. 2003
Firstpage :
1256
Abstract :
This paper presents a novel design simulation method that integrates both the layout and circuit designs in a single design platform. The layout of a power amplifier (PA) module can be optimized in seconds of simulation time. By incorporating advanced behavioral modeling techniques, the presented method is also capable of analyzing the complex digital modulation quality of a power amplifier (PA) module in much less time as compared with conventional non-integrated methods. Design examples for CDMA and Wireless LAN (WLAN) PAs are presented, showing excellent performance. The comparisons and design considerations of semiconductor and packaging technologies are also provided.
Keywords :
MMIC power amplifiers; cellular radio; circuit layout CAD; circuit simulation; code division multiple access; integrated circuit layout; multichip modules; wireless LAN; CAD tools; CDMA; S-parameters; WLAN power amplifier; advanced behavioral modeling; circuit designs; complex digital modulation quality; integrated design simulation method; layout designs; linear cellular power amplifiers; low cost multiple-chip module; single design platform; ultralinear power amplifiers; Circuit simulation; Design methodology; Heterojunction bipolar transistors; Laminates; Linearity; Multiaccess communication; Packaging; Power amplifiers; Wireless LAN; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits and Systems, 2003. ICECS 2003. Proceedings of the 2003 10th IEEE International Conference on
Print_ISBN :
0-7803-8163-7
Type :
conf
DOI :
10.1109/ICECS.2003.1301742
Filename :
1301742
Link To Document :
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