A novel integrated design simulation method for linear cellular and WLAN power amplifiers

Author

Kuran, S. ; Huang, Chun-Wen Paul ; Xu, Sheldon

Author_Institution

Anadigics Inc., Warren, NJ, USA

Volume

3

fYear

2003

fDate

14-17 Dec. 2003

Firstpage

1256

Abstract

This paper presents a novel design simulation method that integrates both the layout and circuit designs in a single design platform. The layout of a power amplifier (PA) module can be optimized in seconds of simulation time. By incorporating advanced behavioral modeling techniques, the presented method is also capable of analyzing the complex digital modulation quality of a power amplifier (PA) module in much less time as compared with conventional non-integrated methods. Design examples for CDMA and Wireless LAN (WLAN) PAs are presented, showing excellent performance. The comparisons and design considerations of semiconductor and packaging technologies are also provided.

Keywords

MMIC power amplifiers; cellular radio; circuit layout CAD; circuit simulation; code division multiple access; integrated circuit layout; multichip modules; wireless LAN; CAD tools; CDMA; S-parameters; WLAN power amplifier; advanced behavioral modeling; circuit designs; complex digital modulation quality; integrated design simulation method; layout designs; linear cellular power amplifiers; low cost multiple-chip module; single design platform; ultralinear power amplifiers; Circuit simulation; Design methodology; Heterojunction bipolar transistors; Laminates; Linearity; Multiaccess communication; Packaging; Power amplifiers; Wireless LAN; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 2003. ICECS 2003. Proceedings of the 2003 10th IEEE International Conference on

Print_ISBN

0-7803-8163-7

Type

conf

DOI

10.1109/ICECS.2003.1301742

Filename

1301742