Title :
New analyses of distributed RC interconnections
Author :
Kahng, Andrew B. ; Muddu, Sudhakar
Author_Institution :
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Abstract :
This paper gives new methods for calculating the time-domain response for a finite-length distributed RC line. We begin with the solution for diffusion in a semi-infinite distributed RC line and apply the method of images (reflections) to obtain the voltage response for a finite-length RC line. Second, we describe a general approach for calculating the time-domain response for finite RC lines with source and load impedances, Next, we obtain new approximate analytical expressions for the voltage response in a finite RC line with resistive source and capacitive load. Delay estimates using this method are very close to SPICE-computed delays; we compare against both SPICE and the recent method of Rao (1995) which calculates delays in an RC line with capacitive load. Our method is simple; for higher accuracy in the response, additional terms can be computed using numerical techniques
Keywords :
VLSI; capacitance; delays; integrated circuit interconnections; time-domain analysis; transmission line theory; VLSI interconnections; capacitive load; delay estimates; distributed RC interconnections; finite-length distributed RC line; method of images; resistive source; time-domain response; voltage response; Delay estimation; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Reflection; SPICE; Time domain analysis; Transfer functions; Voltage; Wires;
Conference_Titel :
Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3073-0
DOI :
10.1109/ISCAS.1996.541945