• DocumentCode
    3027684
  • Title

    Investigations on hydrogen in silicon by means of lifetime measurements

  • Author

    Hauser, A. ; Spiegel, M. ; Fath, P. ; Bucher, E.

  • Author_Institution
    Fakultat fur Phys., Konstanz Univ., Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    Various techniques (SIMS, thermal effusion, FTIR) have been suggested for the determination of the diffusion of hydrogen in multicrystalline silicon. However these methods are either laborious or of a minor accuracy. Our work concentrates on the determination of hydrogen passivation depths in mc-Si by determining the minority carrier lifetime as a function of hydrogen passivation time. For the investigations EMC silicon and reference FZ silicon wafers have been used. From experimental data the passivation depth is obtained numerically using the simulation software PC1D and analytically using a simplified equation. For EMC, passivation depths in regions of good and poor quality have been obtained indicating no significant influence on the passivation depth. Further experiments by polishing the wafer prior to lifetime measurements with a small angle have been performed for determination of the SRV
  • Keywords
    Fourier transform spectroscopy; carrier lifetime; elemental semiconductors; hydrogen; infrared spectroscopy; minority carriers; passivation; secondary ion mass spectroscopy; silicon; EMC silicon wafers; FTIR; FZ silicon wafers; H; PC1D simulation software; SIMS; Si; hydrogen passivation; lifetime measurements; microwave photoconductance decay; minority carrier lifetime; multicrystalline silicon; passivation depth; remote plasma; thermal effusion; Analytical models; Charge carrier lifetime; Electromagnetic compatibility; Equations; Hydrogen; Lifetime estimation; Numerical simulation; Passivation; Performance evaluation; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
  • Conference_Location
    Anchorage, AK
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-5772-8
  • Type

    conf

  • DOI
    10.1109/PVSC.2000.915828
  • Filename
    915828