• DocumentCode
    3027755
  • Title

    Integrated comprehensive methodology based on DEA and PCA

  • Author

    Chunyan Yao

  • Author_Institution
    Res. Inst. of Regional Econ., Beihua Univ., Jilin, China
  • fYear
    2013
  • fDate
    20-22 Dec. 2013
  • Firstpage
    2401
  • Lastpage
    2404
  • Abstract
    Data Envelopment Analysis (DEA) is a kind of comprehensive evaluation method to rank and calculate the corresponding efficiency for each Decision Making Unit (DMU) by constructing a production frontier in multiple inputs and outputs system. For each DMU, we can use multiple variables to describe the characters of DMU, which can be classified as input variables and output variables separately. In traditional DEA models, we needn´t do any transformation for input and output variables when we apply DEA into evaluation procedure because the linear programming can allocate optimal weights for different variables based on the principle of the lower inputs and higher outputs the better. However, traditional DEA models can obtain weak evaluation results that most of DMUs are efficient when each DMU has large amount input variables and output variables. To overcome the shortcoming of DEA models, we proposed an integrated DEA model, denoted as PCA-DEA, in this paper. By using CPA arithmetic, the original data for each DMU can be transferred into uncorrelated data. Then, CPA-DEA models have stronger evaluation capability than traditional DEA models.
  • Keywords
    data envelopment analysis; decision making; linear programming; principal component analysis; CPA arithmetic; DEA; DMU; PCA; data envelopment analysis; decision making unit; integrated comprehensive methodology; linear programming; principal component analysis; Biological system modeling; Data models; Educational institutions; Indexes; Input variables; Linear programming; Principal component analysis; Data Envelopment Analysis; Principle Component Analysis; comprehensive evaluation; weights;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
  • Conference_Location
    Shengyang
  • Print_ISBN
    978-1-4799-2564-3
  • Type

    conf

  • DOI
    10.1109/MEC.2013.6885439
  • Filename
    6885439