• DocumentCode
    3027910
  • Title

    Large-scale atomistic simulations of nanoindentation and crack propagation under compression

  • Author

    Kalia, Rajiv K. ; Nakano, Aiichiro ; Szlufarska, Izabela ; Vashishta, Priya

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2004
  • fDate
    7-11 June 2004
  • Firstpage
    17
  • Lastpage
    19
  • Abstract
    Large-scale molecular dynamics (MD) simulations have been performed on parallel computers to study nanoindentation-induced amorphization in silicon carbide crystal. The load-displacement response exhibits an elastic shoulder followed by a plastic regime consisting of a series of load drops. Analyses of bond angles, local pressure and shear stress, and shortest-path rings show that these load drops are related to dislocation activities under the indenter. We have found that amorphization is driven by the coalescence of dislocation loops and that there is a strong correlation between load-displacement response and ring distribution. Current efforts focus on large-scale MD simulations of (a) nanoindentation in amorphous and nanophase SiC and (b) crack propagation in amorphous and nanostructured SiO/sub 2/ under compression.
  • Keywords
    amorphisation; cracks; dislocation loops; elasticity; indentation; molecular dynamics method; physics computing; plasticity; silicon compounds; solid-state phase transformations; stress analysis; amorphization; crack propagation; dislocation loop; large-scale atomistic simulation; large-scale molecular dynamic simulation; load-displacement; nanoindentation; parallel computer; ring distribution; silicon carbide crystal; Amorphous materials; Computational modeling; Computer simulation; Concurrent computing; Crystalline materials; Crystallization; Large-scale systems; Physics computing; Plastics; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Users Group Conference (DOD_UGC'04), 2004
  • Conference_Location
    Williamsburg, VA, USA
  • Print_ISBN
    0-7695-2259-9
  • Type

    conf

  • DOI
    10.1109/DOD_UGC.2004.25
  • Filename
    1420846