DocumentCode :
3027932
Title :
Development of RIE-textured silicon solar cells
Author :
Damiani, B.M. ; Lüdemann, R. ; Ruby, D.S. ; Zaidi, S.H. ; Rohatgi, A.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2000
fDate :
2000
Firstpage :
371
Lastpage :
374
Abstract :
A maskless plasma texturing technique using reactive ion etching (RIE) for silicon solar cells results in a very low reflectance of 5.4% before, and 3.9% after SiN deposition. A detailed study of surface recombination and emitter properties was made, then solar cells were fabricated using the DOSS solar cell process. Different plasma-damage removal treatments are tested to optimize low lifetime solar cell efficiencies. Highest efficiencies are observed for little or no plasma-damage removal etching on mc-Si. Increased Jsc due to the RIE texture proved superior to a single layer anti-reflection coating. This indicates that RIE texturing is a promising texturing technique, especially applicable on lower lifetime (multicrystalline) silicon. The use of nontoxic, noncorrosive SF6 makes this process attractive for mass production
Keywords :
antireflection coatings; elemental semiconductors; plasma materials processing; silicon; solar cells; sputter etching; surface recombination; surface texture; DOSS solar cell fabrication process; RIE-textured silicon solar cells; SF6; Si; SiN; SiN deposition; anti-reflection coating; emitter properties; lifetime; maskless plasma texturing technique; mass production; open circuit current; reactive ion etching; surface recombination; Coatings; Etching; Life testing; Mass production; Photovoltaic cells; Plasma applications; Plasma properties; Reflectivity; Silicon compounds; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location :
Anchorage, AK
ISSN :
0160-8371
Print_ISBN :
0-7803-5772-8
Type :
conf
DOI :
10.1109/PVSC.2000.915843
Filename :
915843
Link To Document :
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