• DocumentCode
    3027932
  • Title

    Development of RIE-textured silicon solar cells

  • Author

    Damiani, B.M. ; Lüdemann, R. ; Ruby, D.S. ; Zaidi, S.H. ; Rohatgi, A.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    371
  • Lastpage
    374
  • Abstract
    A maskless plasma texturing technique using reactive ion etching (RIE) for silicon solar cells results in a very low reflectance of 5.4% before, and 3.9% after SiN deposition. A detailed study of surface recombination and emitter properties was made, then solar cells were fabricated using the DOSS solar cell process. Different plasma-damage removal treatments are tested to optimize low lifetime solar cell efficiencies. Highest efficiencies are observed for little or no plasma-damage removal etching on mc-Si. Increased Jsc due to the RIE texture proved superior to a single layer anti-reflection coating. This indicates that RIE texturing is a promising texturing technique, especially applicable on lower lifetime (multicrystalline) silicon. The use of nontoxic, noncorrosive SF6 makes this process attractive for mass production
  • Keywords
    antireflection coatings; elemental semiconductors; plasma materials processing; silicon; solar cells; sputter etching; surface recombination; surface texture; DOSS solar cell fabrication process; RIE-textured silicon solar cells; SF6; Si; SiN; SiN deposition; anti-reflection coating; emitter properties; lifetime; maskless plasma texturing technique; mass production; open circuit current; reactive ion etching; surface recombination; Coatings; Etching; Life testing; Mass production; Photovoltaic cells; Plasma applications; Plasma properties; Reflectivity; Silicon compounds; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
  • Conference_Location
    Anchorage, AK
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-5772-8
  • Type

    conf

  • DOI
    10.1109/PVSC.2000.915843
  • Filename
    915843