• DocumentCode
    3028366
  • Title

    Modeling and analysis of path delay faults in VLSI circuits: a statistical approach

  • Author

    Hamad, Moez

  • Author_Institution
    Dept. of Electr. & Comput. & Commun. Eng., Notre Dame Univ.-Louaize, Zouk Mikael, Lebanon
  • Volume
    2
  • fYear
    2003
  • fDate
    14-17 Dec. 2003
  • Firstpage
    587
  • Abstract
    With the increased densities of integrated circuits, several different types of faults can occur. Faults in digital circuits resulting from random defects can introduce DC (stuck-at) faults as well as AC (delay) faults. Previous work in statistical modeling and analysis for delay fault testing generally assumes that at most a single delay fault can occur along any given path in the circuit under test. In this paper we investigate the statistical effect of multiple delay faults along any path in a circuit under test, and predict the path delay fault probabilities as well as the maximum number of path delay faults for both combinational and sequential benchmark circuits. We begin with the development of a statistical model for path delay faults in VLSI circuits [4], which takes into account multiple delay faults along any signal path.
  • Keywords
    CMOS logic circuits; VLSI; combinational circuits; delays; fault simulation; integrated circuit testing; logic testing; sequential circuits; statistical distributions; AC faults; CMOS commercial cell library; DC faults; VLSI circuits; combinational benchmark circuits; delay fault probabilities; digital circuits; distributed fault model; multiple delay faults; path delay faults; random defects; sequential benchmark circuits; statistical approach; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Delay effects; Fault detection; Propagation delay; Semiconductor device modeling; Timing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems, 2003. ICECS 2003. Proceedings of the 2003 10th IEEE International Conference on
  • Print_ISBN
    0-7803-8163-7
  • Type

    conf

  • DOI
    10.1109/ICECS.2003.1301853
  • Filename
    1301853