Title :
RePro3D: full-parallax 3D display with haptic feedback using retro-reflective projection technology
Author :
Yoshida, Takumi ; Shimizu, Keitaro ; Kurogi, Tadatoshi ; Kamuro, Sho ; Minamizawa, Kouta ; Nii, Hideaki ; Tachi, Susumu
Author_Institution :
Univ. of Tokyo, Tokyo, Japan
Abstract :
We propose a novel full-parallax three-dimensional (3D) display system-RePro3D-that is suitable for interactive 3D applications with haptic feedback.Our approach is based on the retro-reflective projection technology in which several images projected from a projector array are displayed on a retro-reflective screen. When viewers view the screen through a half mirror, they see, without the aid of glasses, a 3D image superimposed in real space. RePro3D has a sensor function that recognizes user input; therefore, it can support some interactive features such as manipulation of 3D objects. In addition, a wearable haptic device, which is a part of our system, provides the user with a sensation of having touched the 3D image. In this paper, we describe the optical system of the high-density projector array used in RePro3D. Then, we describe the development of a prototype of RePro3D. The prototype is used to demonstrate that our system displays full-parallax images superimposed in real space from 42 different viewpoints. The proposed system enables a user to physically interact with the 3D image with haptic feedback.
Keywords :
haptic interfaces; human computer interaction; multimedia systems; optical projectors; solid modelling; tactile sensors; three-dimensional displays; touch sensitive screens; virtual reality; 3D object manipulation; RePro3D; full parallax 3D display; half mirror view; haptic feedback; high density projector array; interactive 3D application; optical system; real space 3D image superimposition; retro reflective projection technology; retro reflective screen; touch sensation; wearable haptic device; Arrays; Haptic interfaces; Image resolution; Lenses; Mirrors; Optical imaging; Three dimensional displays;
Conference_Titel :
VR Innovation (ISVRI), 2011 IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-0055-2
Electronic_ISBN :
978-1-4577-0054-5
DOI :
10.1109/ISVRI.2011.5759601