DocumentCode :
3030756
Title :
Power-switch gate-oxide breakdown tolerance techniques for power-gated SRAM
Author :
Yang, Hao-I ; Chuang, Ching-Te ; Hwang, Wei
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear :
2010
fDate :
2-4 June 2010
Firstpage :
102
Lastpage :
105
Abstract :
The gate-oxide breakdowns (BD) of the power-switches have severe and even detrimental effects on the margin, stability, and performance of the power-gated SRAM. This paper proposes and evaluates several techniques to mitigate the power-switch gate-oxide BD, including adding a gate series resistance to the power switch, dual threshold voltage power switch, thick gate-oxide power switch, and dual gate-oxide thickness power switch. It is shown that dual gate-oxide thickness power switch improves the time-to-dielectric-breakdown of the power switch while maintaining the performance without side effect.
Keywords :
SRAM chips; electric breakdown; power semiconductor switches; dual gate-oxide thickness power switch; dual threshold voltage power switch; gate series resistance; gate-oxide breakdown tolerance; power-gated SRAM; power-switch; thick gate-oxide power switch; time-to-dielectric-breakdown; Breakdown voltage; CMOS technology; Circuit synthesis; Electric breakdown; Power engineering and energy; Random access memory; Semiconductor device modeling; Stability; Switches; Threshold voltage; SRAM; gate-oxide breakdown; power gating technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design and Technology (ICICDT), 2010 IEEE International Conference on
Conference_Location :
Grenoble
Print_ISBN :
978-1-4244-5773-1
Type :
conf
DOI :
10.1109/ICICDT.2010.5510278
Filename :
5510278
Link To Document :
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