• DocumentCode
    3030756
  • Title

    Power-switch gate-oxide breakdown tolerance techniques for power-gated SRAM

  • Author

    Yang, Hao-I ; Chuang, Ching-Te ; Hwang, Wei

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    2-4 June 2010
  • Firstpage
    102
  • Lastpage
    105
  • Abstract
    The gate-oxide breakdowns (BD) of the power-switches have severe and even detrimental effects on the margin, stability, and performance of the power-gated SRAM. This paper proposes and evaluates several techniques to mitigate the power-switch gate-oxide BD, including adding a gate series resistance to the power switch, dual threshold voltage power switch, thick gate-oxide power switch, and dual gate-oxide thickness power switch. It is shown that dual gate-oxide thickness power switch improves the time-to-dielectric-breakdown of the power switch while maintaining the performance without side effect.
  • Keywords
    SRAM chips; electric breakdown; power semiconductor switches; dual gate-oxide thickness power switch; dual threshold voltage power switch; gate series resistance; gate-oxide breakdown tolerance; power-gated SRAM; power-switch; thick gate-oxide power switch; time-to-dielectric-breakdown; Breakdown voltage; CMOS technology; Circuit synthesis; Electric breakdown; Power engineering and energy; Random access memory; Semiconductor device modeling; Stability; Switches; Threshold voltage; SRAM; gate-oxide breakdown; power gating technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design and Technology (ICICDT), 2010 IEEE International Conference on
  • Conference_Location
    Grenoble
  • Print_ISBN
    978-1-4244-5773-1
  • Type

    conf

  • DOI
    10.1109/ICICDT.2010.5510278
  • Filename
    5510278