• DocumentCode
    3030865
  • Title

    CMOS 3-axis accelerometers with integrated amplifier

  • Author

    Kruglick, E.J.J. ; Warneke, B.A. ; Pister, K.S.J.

  • Author_Institution
    Berkeley Sensor & Actuator Center, California Univ., Berkeley, CA, USA
  • fYear
    1998
  • fDate
    25-29 Jan 1998
  • Firstpage
    631
  • Lastpage
    636
  • Abstract
    Design, fabrication, and testing of multi-axis CMOS piezoresistive accelerometers is described. Vertical axis accelerometers have been fabricated in multiple processes using a production tested maskless bulk etch step. Horizontal axis accelerometers have also been fabricated and require an additional assembly step. Acceleration sensing in based on the piezoresistive behavior of the gate polysilicon in standard CMOS. Integrated amplifiers were designed and built on chip and have been characterized. Characterization is also presented for sensitivity, angular response, frequency response, axis of maximum sensitivity, temperature coefficient of offset, and temperature coefficient of sensitivity. Results are presented for a single chip with integrated full three axis acceleration sensing
  • Keywords
    CMOS integrated circuits; accelerometers; integrated circuit technology; microsensors; piezoresistive devices; preamplifiers; semiconductor technology; CMOS 3-axis accelerometers; angular response; fabrication; frequency response; gate polysilicon; horizontal axis accelerometers; integrated amplifiers; integrated three axis acceleration sensing; maskless bulk etch step; multi-axis piezoresistive accelerometers; multiple processes; piezoresistive behavior; sensitivity; temperature coefficient; testing; vertical axis accelerometers; Acceleration; Accelerometers; Assembly; Etching; Fabrication; Frequency response; Piezoresistance; Production; Temperature sensors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
  • Conference_Location
    Heidelberg
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-4412-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1998.659831
  • Filename
    659831