DocumentCode :
3030926
Title :
The power7TM processor SoC
Author :
Wendel, Dieter ; Kalla, Ronald ; Friedrich, Joshua ; Kahle, James ; Leenstra, Jens ; Lichtenau, Cedric ; Sinharoy, Balaram ; Starke, William ; Zyuban, Victor
fYear :
2010
fDate :
2-4 June 2010
Firstpage :
71
Lastpage :
73
Abstract :
Introducing POWER7™ the latest member of the IBM POWER™ processor family. A 567 mm2 chip implemented in 45nm SOI technology, holding eight quad threaded cores, a 32MB shared eDRAM L3, two memory controllers and high bandwidth SMP interfaces. The new out of order, shallow pipeline core with 12 execution units, multiport L1 caches and a private 256 kB L2 offers the efficiency to support 4× the number of cores within the same power envelope as its predecessor. Supporting over 4 GHz, the L1 data cache loop is kept to 2 cycles. Data from the L2 can be returned to the core at a rate of 32 B per cycle.
Keywords :
DRAM chips; cache storage; microprocessor chips; silicon-on-insulator; system-on-chip; IBM POWER processor family; L1 data cache loop; L2 data cache; Power7 processor; SMP interfaces; SOI technology; SoC; memory controllers; memory size 32 MByte; multiport L1 caches; quad threaded cores; shallow pipeline core; shared eDRAM L3; size 45 nm; CMOS technology; Clocks; Control systems; Frequency; Logic devices; Power distribution; Random access memory; Subthreshold current; Voltage; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design and Technology (ICICDT), 2010 IEEE International Conference on
Conference_Location :
Grenoble
Print_ISBN :
978-1-4244-5773-1
Type :
conf
DOI :
10.1109/ICICDT.2010.5510286
Filename :
5510286
Link To Document :
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