DocumentCode
3031049
Title
Capacitive sensing type surface micromachined silicon accelerometer with a stiffness tuning capability
Author
Park, K.Y. ; Lee, C.W. ; Jang, H.S. ; Oh, Y.S. ; Ha, B.J.
Author_Institution
R&D Center, Samsung Electro-Mech. Co., Suwon, South Korea
fYear
1998
fDate
25-29 Jan 1998
Firstpage
637
Lastpage
642
Abstract
A novel concept surface micromachined silicon accelerometer which has a stiffness tuning capability to improve the sensor resolution is developed. The stiffness of the sensor structure is reduced by providing an electrostatic negative stiffness. By adopting the stiffness tuning, the initially stiff structure guarantees the stability of the fabrication and the reduced stiffness only along the sensing direction produces the improved resolution. In particular, one of the improved structure of this accelerometer is a branched comb-finger that senses the relative position between the mass and the electrode itself. Maintaining the same capacitance variation, it is able to achieve a larger initial gap between the mass and the electrode which fences the clash problem. The accelerometer has an active size of 650×530 μm2, a thickness of polysilicon structure of 7 μm, and a proof mass of about 1 μg. Experimental results shows that the equivalent noise level of the accelerometer is improved by 30 dB through the stiffness tuning. The accelerometer has a bandwidth of 350 Hz, a linearity of 0.3% FS, and a sensing range of 50 g
Keywords
accelerometers; calibration; elemental semiconductors; microsensors; silicon; tuning; 1 mug; 30 dB; 350 Hz; 7 mum; Si; Si surface micromachined accelerometer; branched comb-finger; calibration; electrostatic negative stiffness; equivalent noise; fabrication; force balanced accelerometer; polysilicon structure; relative displacement; stiffness tuning; suspension; Accelerometers; Bandwidth; Capacitance; Electrodes; Electrostatics; Fabrication; Linearity; Noise level; Silicon; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location
Heidelberg
ISSN
1084-6999
Print_ISBN
0-7803-4412-X
Type
conf
DOI
10.1109/MEMSYS.1998.659832
Filename
659832
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