• DocumentCode
    3031049
  • Title

    Capacitive sensing type surface micromachined silicon accelerometer with a stiffness tuning capability

  • Author

    Park, K.Y. ; Lee, C.W. ; Jang, H.S. ; Oh, Y.S. ; Ha, B.J.

  • Author_Institution
    R&D Center, Samsung Electro-Mech. Co., Suwon, South Korea
  • fYear
    1998
  • fDate
    25-29 Jan 1998
  • Firstpage
    637
  • Lastpage
    642
  • Abstract
    A novel concept surface micromachined silicon accelerometer which has a stiffness tuning capability to improve the sensor resolution is developed. The stiffness of the sensor structure is reduced by providing an electrostatic negative stiffness. By adopting the stiffness tuning, the initially stiff structure guarantees the stability of the fabrication and the reduced stiffness only along the sensing direction produces the improved resolution. In particular, one of the improved structure of this accelerometer is a branched comb-finger that senses the relative position between the mass and the electrode itself. Maintaining the same capacitance variation, it is able to achieve a larger initial gap between the mass and the electrode which fences the clash problem. The accelerometer has an active size of 650×530 μm2, a thickness of polysilicon structure of 7 μm, and a proof mass of about 1 μg. Experimental results shows that the equivalent noise level of the accelerometer is improved by 30 dB through the stiffness tuning. The accelerometer has a bandwidth of 350 Hz, a linearity of 0.3% FS, and a sensing range of 50 g
  • Keywords
    accelerometers; calibration; elemental semiconductors; microsensors; silicon; tuning; 1 mug; 30 dB; 350 Hz; 7 mum; Si; Si surface micromachined accelerometer; branched comb-finger; calibration; electrostatic negative stiffness; equivalent noise; fabrication; force balanced accelerometer; polysilicon structure; relative displacement; stiffness tuning; suspension; Accelerometers; Bandwidth; Capacitance; Electrodes; Electrostatics; Fabrication; Linearity; Noise level; Silicon; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
  • Conference_Location
    Heidelberg
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-4412-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1998.659832
  • Filename
    659832