DocumentCode :
3031049
Title :
Capacitive sensing type surface micromachined silicon accelerometer with a stiffness tuning capability
Author :
Park, K.Y. ; Lee, C.W. ; Jang, H.S. ; Oh, Y.S. ; Ha, B.J.
Author_Institution :
R&D Center, Samsung Electro-Mech. Co., Suwon, South Korea
fYear :
1998
fDate :
25-29 Jan 1998
Firstpage :
637
Lastpage :
642
Abstract :
A novel concept surface micromachined silicon accelerometer which has a stiffness tuning capability to improve the sensor resolution is developed. The stiffness of the sensor structure is reduced by providing an electrostatic negative stiffness. By adopting the stiffness tuning, the initially stiff structure guarantees the stability of the fabrication and the reduced stiffness only along the sensing direction produces the improved resolution. In particular, one of the improved structure of this accelerometer is a branched comb-finger that senses the relative position between the mass and the electrode itself. Maintaining the same capacitance variation, it is able to achieve a larger initial gap between the mass and the electrode which fences the clash problem. The accelerometer has an active size of 650×530 μm2, a thickness of polysilicon structure of 7 μm, and a proof mass of about 1 μg. Experimental results shows that the equivalent noise level of the accelerometer is improved by 30 dB through the stiffness tuning. The accelerometer has a bandwidth of 350 Hz, a linearity of 0.3% FS, and a sensing range of 50 g
Keywords :
accelerometers; calibration; elemental semiconductors; microsensors; silicon; tuning; 1 mug; 30 dB; 350 Hz; 7 mum; Si; Si surface micromachined accelerometer; branched comb-finger; calibration; electrostatic negative stiffness; equivalent noise; fabrication; force balanced accelerometer; polysilicon structure; relative displacement; stiffness tuning; suspension; Accelerometers; Bandwidth; Capacitance; Electrodes; Electrostatics; Fabrication; Linearity; Noise level; Silicon; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
ISSN :
1084-6999
Print_ISBN :
0-7803-4412-X
Type :
conf
DOI :
10.1109/MEMSYS.1998.659832
Filename :
659832
Link To Document :
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