• DocumentCode
    3031211
  • Title

    A method for indirect measurement of vibration stress of thin cylindrical shell

  • Author

    Hui Li ; Jingyu Zhai ; Dejun Pan ; Qingkai Han

  • Author_Institution
    Sch. of Mech. Eng. & Autom., Northeastern Univ., Shenyang, China
  • fYear
    2013
  • fDate
    20-22 Dec. 2013
  • Firstpage
    3673
  • Lastpage
    3677
  • Abstract
    A method for indirect measurement of vibration stress of thin cylindrical shell (TCS) was proposed in this study. Firstly, TCS´s vibration stress and response under different base excitation amplitudes were calculated by harmonic response analysis method. Subsequently the relationship between the vibration stress and response of TCS was established, so that indirect measurement principle of vibration stress was clarified. Secondly, the procedure of indirectly measuring TCS´s vibration stress was proposed, and its key steps, such as the determination of Rayleigh damping and modification of finite element model of TCS through the experimental results were explained in details. Finally, practicability and accuracy of this indirect method was demonstrated by a study case. The results showed that indirect measurement results of vibration stress had good agreements with actual experimental results, which can provide a new idea for obtaining TCS´s vibration stress.
  • Keywords
    damping; finite element analysis; shells (structures); structural engineering; vibration measurement; Rayleigh damping; TCS; base excitation amplitudes; finite element model; harmonic response analysis method; indirect measurement; thin cylindrical shell; vibration response; vibration stress; Damping; Frequency measurement; Strain; Stress; Stress measurement; Vibration measurement; Vibrations; indirect measurement; thin cylindrical shell; vibration response; vibration stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
  • Conference_Location
    Shengyang
  • Print_ISBN
    978-1-4799-2564-3
  • Type

    conf

  • DOI
    10.1109/MEC.2013.6885635
  • Filename
    6885635