• DocumentCode
    3031254
  • Title

    Analysis of performance impact caused by power supply noise in deep submicron devices

  • Author

    Jiang, Yi-Min ; Cheng, Kwang-Ting

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    760
  • Lastpage
    765
  • Abstract
    The paper addresses the problem of analyzing the performance degradation caused by noise in power supply lines for deep submicron CMOS devices. We first propose a statistical modeling technique for the power supply noise including inductive ΔI noise and power net IR voltage drop. The model is then integrated with a statistical timing analysis framework to estimate the performance degradation caused by the power supply noise. Experimental results of our analysis framework, validated by HSPICE, for benchmark circuits implemented on both 0.25 μ, 2.5 V and 0.55 μ, 3.3 V technologies are presented and discussed. The results show that on average, with the consideration of this noise effect, the circuit critical path delays increase by 33% and 18%, respectively for circuits implemented on these two technologies
  • Keywords
    CMOS integrated circuits; SPICE; VLSI; circuit simulation; delays; integrated circuit modelling; integrated circuit noise; power supply circuits; statistical analysis; timing; 0.25 micron; 0.55 micron; 2.5 V; 3.3 V; CMOS devices; HSPICE; benchmark circuits; circuit critical path delays; deep submicron devices; inductive noise; performance degradation; performance impact; power net IR voltage drop; power supply lines; power supply noise; statistical modeling technique; statistical timing analysis framework; Circuit noise; Degradation; Integrated circuit interconnections; Noise level; Performance analysis; Power supplies; Probability density function; Propagation delay; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1999. Proceedings. 36th
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    1-58113-092-9
  • Type

    conf

  • DOI
    10.1109/DAC.1999.782118
  • Filename
    782118