Title :
Dealing with inductance in high-speed chip design
Author :
Restle, Phillip ; Ruehli, Albert ; Walker, Steven G.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Inductance effects in on-chip interconnects have become significant for specific cases such as clock distributions and other highly optimized networks. Designers and CAD tool developers are searching for ways to deal with these effects. Unfortunately, accurate on-chip inductance extraction and simulation in the general case are much more difficult than capacitance extraction. In addition, even if ideal extraction tools existed, most chip designers have little experience designing with lossy transmission lines. This tutorial will attempt to demystify on-chip inductance through the discussion of several illustrative on-chip examples analyzed using full-wave extraction and simulation methods. A specialized PEEC (partial element equivalent circuit) method tailored for chip applications was used for most cases. Effects such as overshoot, reflections, frequency dependent effective resistance and inductance will be illustrated using animated visualizations of our full-wave simulations. Simple examples of design techniques to avoid, mitigate, and even take advantage of on-chip inductance effects will be described
Keywords :
circuit CAD; clocks; equivalent circuits; high-speed integrated circuits; inductance; integrated circuit design; integrated circuit interconnections; CAD tool; PEEC; animated visualizations; clock distributions; frequency dependent effective resistance; full-wave extraction; high-speed chip design; highly optimized networks; inductance; lossy transmission lines; on-chip interconnects; overshoot; partial element equivalent circuit; Capacitance; Chip scale packaging; Circuit simulation; Clocks; Design automation; Distributed parameter circuits; Inductance; Integrated circuit interconnections; Network-on-a-chip; Propagation losses;
Conference_Titel :
Design Automation Conference, 1999. Proceedings. 36th
Conference_Location :
New Orleans, LA
Print_ISBN :
1-58113-092-9
DOI :
10.1109/DAC.1999.782218