DocumentCode :
3033315
Title :
Diagnostic analysis of silicon photovoltaic modules after 20-year field exposure
Author :
Quintana, M.A. ; King, D.L. ; Hosking, F.M. ; Kratochvil, J.A. ; Johnson, R.W. ; Hansen, B.R. ; Dhere, N.G. ; Pandit, M.B.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fYear :
2000
fDate :
2000
Firstpage :
1420
Lastpage :
1423
Abstract :
The objective of this study was to investigate the technology used by Spectrolab Inc. to manufacture photovoltaic modules that have provided twenty years of reliable service at Natural Bridges National Monument in southeastern Utah. A field survey, system performance tests, and a series of module and materials tests have confirmed the durability of the modules in the array. The combination of manufacturing processes, materials, and quality controls used by Spectrolab resulted in modules that have maintained a performance level close to the original specifications for twenty years. Specific contributors to the durability of the modules included polyvinyl-butyral (PVB) encapsulant, expanded metal interconnects, silicon oxide anti-reflective coating, and excellent solder/substrate solderability
Keywords :
elemental semiconductors; fault diagnosis; semiconductor device manufacture; semiconductor device measurement; semiconductor device reliability; semiconductor device testing; silicon; solar cell arrays; 20 y; PV modules manufacture; Si; Spectrolab Inc.; diagnostic analysis; durability; expanded metal interconnects; field survey; performance tests; photovoltaic modules; polyvinyl-butyral encapsulant; quality controls; silicon oxide anti-reflective coating; solder/substrate solderability; Bridges; Coatings; Manufacturing processes; Materials testing; Photovoltaic systems; Quality control; Silicon; Solar power generation; System performance; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location :
Anchorage, AK
ISSN :
0160-8371
Print_ISBN :
0-7803-5772-8
Type :
conf
DOI :
10.1109/PVSC.2000.916159
Filename :
916159
Link To Document :
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