• DocumentCode
    3034335
  • Title

    Use of electronic module descriptions for modular and Reconfigurable Assembly Systems

  • Author

    Siltala, Niko ; Tuokko, Reijo

  • Author_Institution
    Dept. of Production Eng., Tampere Univ. of Technol., Tampere, Finland
  • fYear
    2009
  • fDate
    17-20 Nov. 2009
  • Firstpage
    214
  • Lastpage
    219
  • Abstract
    The paper presents how a newly developed emplacement concept can be utilised for designing, deployment and execution of modular evolvable or reconfigurable assembly systems. The emplacement concept specifies the assembly modules in electronic description formats (XML based), which consists at the moment emplacement and blue print file formats. The former is used for abstract level specifications and for harmonisation of modules. These files are specified by a user group. The latter is the virtual representation of the module itself provided by the module vendor. The module interfaces (preferably basing on international interface standards), processing/manufacturing capabilities (i.e. skills) and standardised processes play important role in the concept. This paper focuses on the use of the concept and how the different interest groups can take advantage of the proposed concept. Also some use cases and tools supporting the concept are presented.
  • Keywords
    manufacturing systems; production engineering computing; virtual manufacturing; blue print file formats; electronic description formats; electronic module descriptions; emplacement concept; module vendor; reconfigurable assembly systems; virtual representation; Assembly systems; Costs; Data handling; Design automation; Manufacturing automation; Manufacturing processes; Production engineering; Production systems; System analysis and design; XML; Assembly systems; Blue Print; Design automation; Electronic Module Description; Electronic data interchange; Emplacement; Manufacturing automation; System analysis and design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
  • Conference_Location
    Suwon
  • Print_ISBN
    978-1-4244-4627-8
  • Electronic_ISBN
    978-1-4244-4628-5
  • Type

    conf

  • DOI
    10.1109/ISAM.2009.5376903
  • Filename
    5376903