Title :
Ceramics packaging with ferroelectric decoupling capacitor
Author :
Tummala, Rao R. ; Eggerding, Carl L.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
Packaging is the most important application of ceramics in microelectronics. The continued evolution of ceramics and the processes with which the most advanced substrates will be fabricated are summarized. A discrete ferroelectric decoupling capacitor providing very low inductance to minimize the delta-I noise of ceramic packages is described
Keywords :
capacitors; ceramics; ferroelectric devices; ferroelectric materials; packaging; substrates; ceramics; delta-I noise; ferroelectric decoupling capacitor; microelectronics; packaging; substrates; Capacitors; Ceramics; Circuits; Conducting materials; Ferroelectric materials; Inductance; Semiconductor device packaging; Substrates; Thermal conductivity; Thermal expansion;
Conference_Titel :
Applications of Ferroelectrics, 1990., IEEE 7th International Symposium on
Conference_Location :
Urbana-Champaign, IL
Print_ISBN :
0-7803-0190-0
DOI :
10.1109/ISAF.1990.200193
