Title :
SOI substrate removal for SEE characterization: Techniques and applications
Author :
Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Stevens, Jeffrey ; Vizkelethy, Gyorgy ; Swanson, Scot E. ; Dalton, Scott M.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
Keywords :
laser beam applications; radiation hardening (electronics); semiconductor device packaging; semiconductor device testing; silicon-on-insulator; substrates; SEE characterization; SOI substrate removal; Si; back substrate removal; heavy-ion testing; laser testing; microbeam testing; packaged devices; Contamination; Etching; Gold; Measurement by laser beam; Silicon; Substrates; Substrate removal; heavy-ion testing; laser testing; microbeam testing;
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2011 12th European Conference on
Conference_Location :
Sevilla
Print_ISBN :
978-1-4577-0585-4
DOI :
10.1109/RADECS.2011.6131447
