DocumentCode
3034970
Title
SOI substrate removal for SEE characterization: Techniques and applications
Author
Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Stevens, Jeffrey ; Vizkelethy, Gyorgy ; Swanson, Scot E. ; Dalton, Scott M.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2011
fDate
19-23 Sept. 2011
Firstpage
683
Lastpage
689
Abstract
Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.
Keywords
laser beam applications; radiation hardening (electronics); semiconductor device packaging; semiconductor device testing; silicon-on-insulator; substrates; SEE characterization; SOI substrate removal; Si; back substrate removal; heavy-ion testing; laser testing; microbeam testing; packaged devices; Contamination; Etching; Gold; Measurement by laser beam; Silicon; Substrates; Substrate removal; heavy-ion testing; laser testing; microbeam testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation and Its Effects on Components and Systems (RADECS), 2011 12th European Conference on
Conference_Location
Sevilla
ISSN
0379-6566
Print_ISBN
978-1-4577-0585-4
Type
conf
DOI
10.1109/RADECS.2011.6131447
Filename
6131447
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