• DocumentCode
    3035438
  • Title

    Micro/nano materials testing for reliable design of MEMS/NEMS

  • Author

    Isono, Yoshitada

  • Author_Institution
    Dept. of Micro Syst. Technol., Ritsumeikan Univ., Shiga, Japan
  • fYear
    2004
  • fDate
    31 Oct.-3 Nov. 2004
  • Firstpage
    33
  • Lastpage
    38
  • Abstract
    This paper describes evaluation techniques of mechanical properties for MEMS/NEMS materials. Micro/Nano Mechanics Laboratory (MNML) in Ritsumeikan, have so far been established several kinds of micro/nano material testing methods for structural design of MEMS/NEMS. Nanoscale bending testing based on an AFM technique was developed to reveal specimen size and temperature effects on elastic-inelastic properties of self-supported single crystal silicon (SCS) nanowires [1], [2]. Fatigue tests of micro- and nanometric SCS specimens were also performed under bending/tensile stressing. Here, a new fatigue damage parameter was proposed for predicting fatigue lives of SCS structures, regardless of deformation mode and specimen size [3], [4]. The tensile tester using AFM revealed stress-strain relation and creep characteristic of electroplated nickel (Ni) films at temperatures ranging from 300 K to 573 K. A few latest testing methods for micro/nano scale specimens are also introduced in this paper.
  • Keywords
    atomic force microscopy; bending; creep; elasticity; elemental semiconductors; fatigue testing; metallic thin films; micromechanical devices; nanowires; nickel; reliability; reviews; semiconductor quantum wires; silicon; stress-strain relations; tensile testing; 300 to 573 K; AFM; MEMS; NEMS; Ni; Si; creep; deformation mode; elastic-inelastic properties; fatigue damage parameter; fatigue tests; material testing methods; mechanical properties; micromaterials testing; nanomaterials testing; nanoscale bending testing; self-supported single crystal; specimen size; stress-strain relation; temperature effects; tensile stressing; Automatic testing; Design methodology; Fatigue; Laboratories; Materials reliability; Materials testing; Mechanical factors; Micromechanical devices; Nanoelectromechanical systems; Nickel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro-Nanomechatronics and Human Science, 2004 and The Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004. Proceedings of the 2004 International Symposium on
  • Print_ISBN
    0-7803-8607-8
  • Type

    conf

  • DOI
    10.1109/MHS.2004.1421259
  • Filename
    1421259