Title :
Development of wireless sensor module and network for temperature monitoring in cold chain logistics
Author :
Chen-Ming Li ; Chin-Chung Nien ; Jia-Liang Liao ; Yu-Chee Tseng
Author_Institution :
Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan
Abstract :
In this paper, a wireless sensor module (WSM) and network used for cool box temperature monitoring in cold chain logistics is presented. The proposed WSM is implemented by integrating mainly a wireless microcontroller JENNIC 5418 based on IEEE 802.15.4 standard with a thermocouple sensing converter MAX31855. The transmitter power and sensitivity of the proposed module are 2.5 dBm and -95 dBm respectively, and the temperature range/resolution of the sensing converter is -40~125°C/0.25°C. In order to demonstrate the communication quality of the proposed WSM, the point-to-point link quality indication (LQI) has been measured in a 20-foot cargo container filled up with the watered Styrofoam boxes. Furthermore, cool box temperature monitoring and cargo container position tracking regularly at remote-end are demanded for preventing the food from perishing under transportation in cold-chain logistics. Therefore, the access point (coordinator) of the wireless sensor network integrated with the GPS and 3G communication system is considerable, and it has been developed in our project.
Keywords :
IEEE standards; Zigbee; logistics; microcontrollers; temperature measurement; wireless sensor networks; 3G communication system; IEEE 802.15.4 standard; cargo container position tracking; cold chain logistics; cool box temperature monitoring; point to point link quality indication; thermocouple sensing converter MAX31855; transmitter power; wireless microcontroller JENNIC 5418; wireless sensor module; wireless sensor network; IEEE 802.15 Standards; Microcontrollers; Monitoring; Temperature distribution; Wireless communication; Wireless sensor networks;
Conference_Titel :
Wireless Information Technology and Systems (ICWITS), 2012 IEEE International Conference on
Conference_Location :
Maui, HI
Print_ISBN :
978-1-4673-0947-9
DOI :
10.1109/ICWITS.2012.6417745