DocumentCode
3035692
Title
Highly productive PCRAM technology platform and full chip operation: Based on 4F2 (84nm pitch) cell scheme for 1 Gb and beyond
Author
Lee, S.H. ; Park, H.C. ; Kim, Myung Su ; Kim, Hyungwook ; Choi, M.R. ; Lee, H.G. ; Seo, Jae Woo ; Kim, Scott C. ; Kim, S.G. ; Hong, S.B. ; Lee, S.Y. ; Lee, Ji Ung ; Kim, Yong Sin ; Kim, Kwang Soon ; Kim, Jong In ; Lee, M.Y. ; Shin, H.S. ; Chae, S.J. ; Son
Author_Institution
R & D Div., Hynix Semicond. Inc., Icheon, South Korea
fYear
2011
fDate
5-7 Dec. 2011
Abstract
We successfully developed highly scalable and cost-effective PCRAM technology based on 0.007um2 (4F2, 84nm pitch) sized novel cell scheme. The chip size and density are 33.207mm2 and 1Gb. The device functionality and reliability were clearly demonstrated through fully integrated chip, which showed a promising feasibility for productive NVM applications.
Keywords
random-access storage; NVM; cell scheme; full chip operation; high productive PCRAM technology platform; integrated chip; Computer architecture; Microprocessors; Phase change random access memory; Programming; Resistance; Sensors; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
978-1-4577-0506-9
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2011.6131480
Filename
6131480
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