Title :
Design and procurement of eutectic Sn/Pb solder-bumped flip chip test die and organic substrates
Author :
Lau, John ; Heydinger, Matt ; Glazer, Judy ; Uno, Dan
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
A case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were fabricated by an IC supplier and bumped with electroplated eutectic Sn/Pb by a third party. Issues associated with transferring integrated circuit data to printed circuit design software were identified. The bare and bumped wafers were characterized to identify possible criteria for lot qualification
Keywords :
electroplating; flip-chip devices; integrated circuit packaging; lead alloys; printed circuits; soldering; tin alloys; SnPb; bumped wafers; electroplated eutectic solder; lot qualification; organic substrates; solder-bumped flip chip test die; Assembly; Circuit testing; Flip chip; Integrated circuit technology; Integrated circuit testing; Printed circuits; Procurement; Resins; Surface-mount technology; Tin;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404677
