Title :
Statistical variability and reliability in nanoscale FinFETs
Author :
Wang, Xingsheng ; Brown, Andrew R. ; Cheng, Binjie ; Asenov, Asen
Author_Institution :
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
Abstract :
A comprehensive full-scale 3D simulation study of statistical variability and reliability in emerging, scaled FinFETs on SOI substrate with gate-lengths of 20nm, 14nm and 10nm and low channel doping is presented. Excellent electrostatic integrity and resulting tolerance to low channel doping are perceived as the main FinFET advantages, resulting in a dramatic reduction of statistical variability due to random discrete dopants (RDD). It is found that line edge roughness (LER), metal gate granularity (MGG) and interface trapped charges (ITC) dominate the parameter fluctuations with different distribution features, while RDD may result in relatively rare but significant changes in the device characteristics.
Keywords :
MOSFET; semiconductor device reliability; silicon-on-insulator; RDD; SOI substrate; comprehensive full-scale 3D simulation study; electrostatic integrity; gate length; interface trapped charge; line edge roughness; low channel doping; metal gate granularity; nanoscale FinFET; random discrete dopant; size 10 nm; size 14 nm; size 20 nm; statistical reliability; statistical variability; Correlation; Doping; FinFETs; Fluctuations; Logic gates; Semiconductor process modeling;
Conference_Titel :
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4577-0506-9
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2011.6131494
