• DocumentCode
    3036055
  • Title

    A unified 3D device simulation of random dopant, interface trap and work function fluctuations on high-к/metal gate device

  • Author

    Li, Yiming ; Cheng, Hui-Wen ; Chiu, Yung-Yueh ; Yiu, Chun-Yen ; Su, Hsin-Wen

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    5-7 Dec. 2011
  • Abstract
    In this work, we for the first time estimate total fluctuation resulting from random dopants (RDs), interface trap (ITs) and work functions (WKs) using experimentally calibrated 3D device simulation on 16-nm-gate high-k/metal gate devices. The total 3D simulated threshold voltage fluctuation (σVth), induced by the aforementioned random sources simultaneously, is 55.5 mV for NMOS; however, a statistical total sum of these fluctuations is 12.3% overestimation because independence assumption on random variables is invalid owing to strong interactions among RDs, ITs and WKs. Device´s DC/AC and CMOS SRAM circuit fluctuations have similar observation. FinFET-based structure innovation possessing large fluctuation suppression (σVth = 30.2 mV; 45.6% reduction), compared with process efforts on planar one, is further discussed.
  • Keywords
    CMOS integrated circuits; MOSFET; SRAM chips; doping profiles; high-k dielectric thin films; interface states; work function; 3D device simulation; 3D simulated threshold voltage fluctuation; CMOS SRAM circuit fluctuations; DC/AC; FinFET-based structure; NMOS; fluctuation suppression; high-k metal gate device; interface trap; random dopant; size 16 nm; total fluctuation; voltage 55.5 mV; work function fluctuations; Fluctuations; Logic gates; Semiconductor process modeling; Solid modeling; Substrates; Three dimensional displays; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2011 IEEE International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4577-0506-9
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2011.6131495
  • Filename
    6131495