A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration

In this paper, two new interconnect technologies designed for integration of a large biosensor array and a signal processing CMOS IC are presented; a TSV technology that can be fabricated in wafers that cannot be aggressively thinned down or have sensitive sensors fabricated in prior processes, and a compliant interconnect technology that enables minimal stress permanent interconnections or low-force temporary interconnections to allow reuse of CMOS ICs. In addition, integration of TSV to a silicon nanowire label-free biosensor is demonstrated.