DocumentCode
3036140
Title
Table of contents
fYear
2010
fDate
6-9 June 2010
Firstpage
1
Lastpage
8
Abstract
The following topics are dealt with: Interconnect Technology; systems and interconnects; process integration; materials and unit process; back end memory and MEMS; reliability and characterization; packaging, 3D and TSV; and novel materials and concept.
Keywords
interconnections; memory architecture; micromechanical devices; packaging; reliability; three-dimensional integrated circuits; MEMS; TSV; back end memory; interconnect technology; novel materials; packaging; process integration; reliability; unit process;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference (IITC), 2010 International
Conference_Location
Burlingame, CA
Print_ISBN
978-1-4244-7676-3
Type
conf
DOI
10.1109/IITC.2010.5510592
Filename
5510592
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