Characteristics of Ni electroformed micro connector used for high density packaging

This study describes that a micro connector has been produced by the combination use of UV thick resist as well as the lithography and the electroforming, and has been evaluated. The fabricated connector has 100 pins with 80 μm pitch. The size of the terminal of fabricated micro connector was 50 μm - thickness and 15 μm - width (minimum). The maximum aspect ratio of the fabricated micro connector is 33 and the terminal pitch is 80 μm. As the evaluation of its specific properties, contact force, contact resistance, Young´s modulus and permissible current have been determined. The contact force is 3.3 mN at 5 μm of the displacement of the socket terminal. The contact resistance among terminals is shown less than 50 mΩ by using four point probe method. The determination of Young´s modulus of Ni structure is found to be 180 GPa by using SPM method. The designed connector treated by Au plating has indicated the possibility to obtain the stable electric contact after the durability test.