• DocumentCode
    3036923
  • Title

    Volumetric Degenerative Routing for 3D Network-on-chip

  • Author

    Bala, D. ; Chao You

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Dakota State Univ., Fargo, ND, USA
  • fYear
    2012
  • fDate
    11-16 Nov. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As we reach the limits of scaling down of circuits, Three Dimensional Integrated Circuits (3D ICs) offer a very promising opportunity to keep on increasing the processing capacities and speed. In a Multi-Processor System-on-Chip (MPSoC) based embedded system with Network-on-chip (NOC) as the communication architecture [1], routing of the traffic among the Processing Elements (PEs) contributes significantly to the global latency, throughput and energy consumption. Almost all prior studies have focused on 2D NOC designs. The field of 3D integration is relatively new and has emerged to provide an alternate solution for high performance computation. This paper introduces a new routing algorithm which aims to improve performance characteristics of conventional existing algorithms. Volumetric Degenerative Routing, as proposed in this paper, reduces maximum delay by as much as 40%.
  • Keywords
    degenerate semiconductors; embedded systems; energy consumption; multiprocessing systems; network routing; network-on-chip; three-dimensional integrated circuits; 3D IC; 3D integration; 3D network-on-chip; MPSoC based embedded system; NOC; PE; circuit scaling; communication architecture; energy consumption; global latency; multiprocessor system-on-chip; processing elements; routing algorithm; three dimensional integrated circuit; throughput; traffic routing; volumetric degenerative routing; Algorithm design and analysis; Clocks; Computer architecture; Delay; Educational institutions; Routing; System recovery; 3D integrated circuits; Network-on-chip; routing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Information Technology and Systems (ICWITS), 2012 IEEE International Conference on
  • Conference_Location
    Maui, HI
  • Print_ISBN
    978-1-4673-0947-9
  • Type

    conf

  • DOI
    10.1109/ICWITS.2012.6417807
  • Filename
    6417807